![]() Pre-applications (which are optional) and full applications for projects that focus on leading-edge facilities will be accepted on a rolling basis beginning March 31. ![]() The application process for the first funding allotment will be split into three parts. Front-end wafer fabrication and back-end packaging projects are included in this initial opportunity as well. ![]() Applications for the first of three funding opportunities, which will target projects to construct, expand, or modernize commercial facilities for the production of “leading-edge, current-generation, and mature-node” semiconductors, will be accepted beginning March 31, 2023. ![]() Department of Commerce’s National Institute of Standards and Technology (NIST) said today that it will soon accept applications for funding set aside by the CHIPS and Science Act of 2022.
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